- 专利标题: WIRELESS POWER TRANSFER AT CHIP SCALE
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申请号: US15979065申请日: 2018-05-14
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公开(公告)号: US20180331579A1公开(公告)日: 2018-11-15
- 发明人: Songbin Gong , Yansong Yang , Justin Postma , Liuqing Gao , Brandon Arakawa
- 申请人: The Board of Trustees of the University of Illinois
- 主分类号: H02J50/12
- IPC分类号: H02J50/12 ; H02J50/05 ; H02J50/80
摘要:
An inductive wireless power transfer apparatus includes a source coil coupled to a power source such that current flows through the source coil when the source coil is excited by the power source. The apparatus further includes a first capacitor coupled in series to the source coil. The apparatus further includes an intermediate coil surrounding the source coil and positioned within an identical plane as the source coil, and a second capacitor coupled in series to the intermediate coil. The capacitances of the first capacitor and the second capacitor are set to tune out self-inductances of the source coil and the intermediate coil. In embodiments, the source coil is to inductively power the intermediate coil, which is to inductively power a load coil positioned a distance away from the intermediate coil.
公开/授权文献
- US11211820B2 Wireless power transfer at chip scale 公开/授权日:2021-12-28
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