A system for hot application of an adhesive composition, comprising an in-line heating device and a corresponding method for hot application of the adhesive composition. The system comprises: an application nozzle for applying the adhesive composition; a supply line for supplying the nozzle with the adhesive composition to be applied in fluid form; a in-line heating device for heating of the adhesive composition to an application temperature, the heating device comprising: a static mixture including an electrically conducting material, and an inductive cable surrounding the static mixer.