Invention Application
- Patent Title: LEAD FRAME
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Application No.: US16105756Application Date: 2018-08-20
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Publication No.: US20180374782A1Publication Date: 2018-12-27
- Inventor: Hironao OKU , Toshiyuki HASHIMOTO , Mitsuhiro ISONO , Takao ISHIHARA , Takaaki KATO
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2017-053207 20170317
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L33/64 ; H01L33/62 ; H01L21/48

Abstract:
A lead frame includes: a plurality of units each including a first lead portion and a second lead portion arranged in a first direction, wherein the units are arranged in the first direction and in a second direction perpendicular to the first direction, and the first lead portion and the second lead portion of each unit are adjacent, in the second direction, to the first lead portion and the second lead portion of an adjacent one of the units that is adjacent in the second direction; a plurality of first suspension portions; and a plurality of connecting portions. Each of the first suspension portions connects, in the second direction, the first lead portions of units that are adjacent to each other in the second direction.
Public/Granted literature
- US10332824B2 Lead frame Public/Granted day:2019-06-25
Information query
IPC分类: