Invention Application
- Patent Title: TRANSISTOR WITH DUAL-GATE SPACER
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Application No.: US15778306Application Date: 2015-12-23
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Publication No.: US20180374927A1Publication Date: 2018-12-27
- Inventor: EN-SHAO LIU , JOODONG PARK , CHEN-GUAN LEE , CHIA-HONG Jan
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- International Application: PCT/US2015/000170 WO 20151223
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/78 ; H01L29/66 ; H01L21/764 ; H01L21/28

Abstract:
Techniques are disclosed for forming a transistor with one or more additional gate spacers. The additional spacers may be formed between the gate and original gate spacers to reduce the parasitic coupling between the gate and the source/drain, for example. In some cases, the additional spacers may include air gaps and/or dielectric material (e.g., low-k dielectric material). In some cases, the gate may include a lower portion and an upper portion. In some such cases, the lower portion of the gate may be narrower in width between the original gate spacers than the upper portion of the gate, which may be as a result of the additional spacers being located between the lower portion of the gate and the original gate spacers. In some such cases, the gate may approximate a “T” shape or various derivatives of that shape such as -shape or -shape, for example.
Public/Granted literature
- US10535747B2 Transistor with dual-gate spacer Public/Granted day:2020-01-14
Information query
IPC分类: