发明申请
- 专利标题: THERMOPILE MODULE
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申请号: US16144249申请日: 2018-09-27
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公开(公告)号: US20190025127A1公开(公告)日: 2019-01-24
- 发明人: MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
- 申请人: PIXART IMAGING INC.
- 优先权: TW104108897 20150320
- 主分类号: G01J5/04
- IPC分类号: G01J5/04 ; G01J5/12 ; G01J5/08 ; G01J5/00
摘要:
An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
公开/授权文献
- US10732049B2 Thermopile module 公开/授权日:2020-08-04