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公开(公告)号：US20230273070A1
公开(公告)日：2023-08-31
申请号：US18143565
申请日：2023-05-04
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
IPC: G01J5/04 , G01J5/12 , G01J5/0875 , G01J5/00 , G01J5/05 , G01J5/0802
CPC classification number: G01J5/048 , G01J5/12 , G01J5/0875 , G01J5/0025 , G01J5/05 , G01J5/0802
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20160349114A1
公开(公告)日：2016-12-01
申请号：US14972563
申请日：2015-12-17
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
CPC classification number: G01J5/048 , G01J5/0025 , G01J5/043 , G01J5/0862 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
Abstract translation: 电子设备包括外壳，电路基板，热电堆传感器芯片，过滤器结构和防水结构。 外壳有一个开口。 电路基板设置在外壳的内部。 热电堆传感器芯片设置在电路基板上。 过滤器结构设置在热电堆传感器芯片的上方。 防水结构围绕连接在过滤器结构和外壳之间以密封外壳的开口，其中防水结构具有用于暴露过滤器结构并与外壳的开口连通的通孔。
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Patent Agency Ranking
公开(公告)号：US20200242226A1
公开(公告)日：2020-07-30
申请号：US16850753
申请日：2020-04-16
Applicant: PixArt Imaging Inc.
Inventor： REN-HAU GU , CHIH-HSIN LIN , TZUNG-MIN SU , YUNG-CHANG LIN , JIAN-CHENG LIAO , CHUN-CHIH CHEN
Abstract: A wearable device including a skin sensor and a processor is provided. The processor is configured to receive an authentication data for authenticating a user when a wearing state of the wearable device is adjacent to a skin surface of the user, execute a predetermined function in response to a request when the authentication data matches a pre-stored data and the skin sensor determines that the wearable device does not leave the skin surface after the authentication data is received, and reject or ignore the request when the skin sensor determines that the wearable device leaves the skin surface before the predetermined function is executed.
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公开(公告)号：US20210199507A1
公开(公告)日：2021-07-01
申请号：US17200713
申请日：2021-03-12
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20200319033A1
公开(公告)日：2020-10-08
申请号：US16906002
申请日：2020-06-19
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20250044157A1
公开(公告)日：2025-02-06
申请号：US18922683
申请日：2024-10-22
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
IPC: G01J5/04 , G01J5/00 , G01J5/05 , G01J5/0802 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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公开(公告)号：US20190025127A1
公开(公告)日：2019-01-24
申请号：US16144249
申请日：2018-09-27
Applicant: PIXART IMAGING INC.
Inventor： MING-HAN TSAI , CHIH-MING SUN , JIAN-CHENG LIAO
CPC classification number: G01J5/048 , G01J5/0025 , G01J5/043 , G01J5/0862 , G01J5/0875 , G01J5/12
Abstract: An electronic device includes an outer case, a circuit substrate, a thermopile sensor chip, a filter structure, and a waterproof structure. The outer case has an opening. The circuit substrate is disposed inside the outer case. The thermopile sensor chip is disposed on the circuit substrate. The filter structure is disposed above the thermopile sensor chip. The waterproof structure is surroundingly connected between the filter structure and the outer case for sealing up the opening of the outer case, wherein the waterproof structure has a through hole for exposing the filter structure and communicated with the opening of the outer case.
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