Invention Application
- Patent Title: THREE-DIMENSIONAL (3D) PRINTING WITH EPOXY MOLD COMPOUND
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Application No.: US16073181Application Date: 2016-04-20
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Publication No.: US20190030799A1Publication Date: 2019-01-31
- Inventor: CHien-Hua Chen , Qin Liu , Michael G. Monroe
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- International Application: PCT/US2016/028520 WO 20160420
- Main IPC: B29C64/165
- IPC: B29C64/165 ; B29C64/393
Abstract:
In a three-dimensional printing method example, an epoxy mold compound build material is applied. A fusing agent is selectively applied on at least a portion of the epoxy mold compound build material. The epoxy mold compound build material is exposed to energy, thereby fusing the portion of the epoxy mold compound build material in contact with the fusing agent to form a layer.
Public/Granted literature
- US10850446B2 Three-dimensional (3D) printing with epoxy mold compound Public/Granted day:2020-12-01
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