Invention Application
- Patent Title: SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
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Application No.: US15686008Application Date: 2017-08-24
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Publication No.: US20190061034A1Publication Date: 2019-02-28
- Inventor: Mark E. Tuttle
- Applicant: Micron Technology, Inc.
- Main IPC: B23K1/018
- IPC: B23K1/018 ; H01L23/00 ; H01L21/66
Abstract:
A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.
Public/Granted literature
- US10307850B2 Solder removal from semiconductor devices Public/Granted day:2019-06-04
Information query
IPC分类:
