Invention Application
- Patent Title: WAFER CONTACT SURFACE PROTRUSION PROFILE WITH IMPROVED PARTICLE PERFORMANCE
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Application No.: US16073648Application Date: 2017-02-02
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Publication No.: US20190067069A1Publication Date: 2019-02-28
- Inventor: John Michael Glasko , I-Kuan Lin , Carlo Waldfried
- Applicant: ENTEGRIS, Inc.
- International Application: PCT/US2017/016145 WO 20170202
- Main IPC: H01L21/683
- IPC: H01L21/683
Abstract:
An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.
Public/Granted literature
- US10770330B2 Wafer contact surface protrusion profile with improved particle performance Public/Granted day:2020-09-08
Information query
IPC分类:
