公开(公告)号：US20250034700A1

公开(公告)日：2025-01-30

申请号：US18785339

申请日：2024-07-26

Applicant: ENTEGRIS, INC.

Inventor： Carlo Waldfried ,  Surendra Maharjan ,  Stephen Longo

IPC: C23C16/30 ,  C23C16/52

Abstract: Surface modified substrates and related methods are provided. A substrate having a modified surface comprises a first region and a second region. The first region is located above the second region. The first region comprises a nickel fluoride. The second region comprises a nickel alloy. A concentration of the nickel fluoride gradually decreases from the first region to the second region.

公开(公告)号：US20250003072A1

公开(公告)日：2025-01-02

申请号：US18755011

申请日：2024-06-26

Applicant: ENTEGRIS, INC.

Inventor： Joseph E. Reynolds, III ,  Michael Watson ,  Bryan C. Hendrix ,  Sara Moghaddam ,  Devon N. Dion ,  Benjamin R. Garrett ,  Carlo Waldfried ,  Virendra Warke

IPC: C23C16/455 ,  C23C16/44

Abstract: High purity molybdenum-containing precursors and related systems and methods are provided. A precursor delivery system comprises a vaporizer vessel that is configured to contain a vaporizable precursor that, when vaporized, produces a precursor vapor. The precursor delivery system comprises at least one protective surface treatment. The at least one protective surface treatment covers a sufficient amount of at least one gas-exposed surface of the precursor delivery system to reduce an amount of at least one contaminant in the precursor vapor as compared to a precursor vapor produced by a precursor delivery system without the at least one protective surface treatment.

公开(公告)号：US20230337407A1

公开(公告)日：2023-10-19

申请号：US18131208

申请日：2023-04-05

Applicant: ENTEGRIS, INC.

Inventor： Yuxuan Liu ,  Zhifeng Li ,  Carlo Waldfried ,  Yan Liu ,  Chandra Venkatraman ,  Pushkara Rao Varanasi

IPC: H05K9/00 ,  H01L21/683

CPC classification number: H05K9/0079 ,  H01L21/6833

Abstract: A conductive polymeric layer on an electrostatic chuck. The conductive polymeric layer comprises a conductive polymer and a photosensitive polymer. The conductivity of the conductive polymer promotes charge dissipation by the conductive polymeric layer, while the photosensitivity of the photosensitive polymer allows the surface of the conductive polymeric layer to be photopatterned. The extent to which the conductive polymeric layer is conductive and photosensitive may be modulated by varying the relative amounts of the conductive polymer and the photosensitive polymer.

公开(公告)号：US20230097687A1

公开(公告)日：2023-03-30

申请号：US17950941

申请日：2022-09-22

Applicant: ENTEGRIS, INC.

Inventor： Carlo Waldfried

IPC: B29C64/30 ,  C23C16/455 ,  C23C16/40

Abstract: Some embodiments relate to additive manufactured articles having coated surfaces and related methods. The methods may comprise forming a three-dimensional (3D) article by additive manufacturing to obtain an additive manufactured 3D article having a monolithic structure that is not capable of construction by machining, and exposing the additive manufactured 3D article to one or more precursor gases to form a coating layer on a surface of the additive manufactured 3D article. The additive manufactured articles may comprise an additive manufactured three-dimensional (3D) body. The additive manufactured 3D body may have a monolithic structure that is not capable of construction by machining. The additive manufactured 3D body may have a coating layer on a surface of the additive manufactured 3D body.

公开(公告)号：US20220316056A1

公开(公告)日：2022-10-06

申请号：US17840367

申请日：2022-06-14

Applicant: ENTEGRIS, INC.

Inventor： I-Kuan Lin ,  Carlo Waldfried ,  Chandra Venkatraman

IPC: C23C16/40 ,  C23C16/455 ,  C23C16/44

Abstract: Described are multi-layer coatings, substrates (i.e., articles) coated with a multi-layer coating, and methods of preparing a multi-layer coating by atomic layer deposition, wherein the coating includes layers alumina and yttria.

公开(公告)号：US20220298639A1

公开(公告)日：2022-09-22

申请号：US17696101

申请日：2022-03-16

Applicant: ENTEGRIS, INC.

Inventor： Nilesh Gunda ,  Jayasri Narayanamoorthy ,  Carlo Waldfried

IPC: C23C16/455 ,  C23C16/40 ,  C23C14/08 ,  H01L21/02 ,  C23C16/56

Abstract: Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.

公开(公告)号：US20160336210A1

公开(公告)日：2016-11-17

申请号：US15111591

申请日：2015-02-06

Applicant: ENTEGRIS, INC.

Inventor： Richard A. Cooke ,  Wolfram Neff ,  Carlo Waldfried ,  Jakub Rybczynski ,  Michael Hanagan ,  Wade Krull

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67248 ,  H01L21/6831

Abstract: An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.

Abstract translation: 静电卡盘包括陶瓷结构元件，设置在陶瓷结构元件上的至少一个电极和设置在至少一个电极上的表面电介质层，该表面层由电极中的电压激活以形成静电电荷 将基板夹紧到静电卡盘。 所述表面介电层包括：（i）厚度小于约5微米的无定形氧化铝绝缘体层，设置在所述至少一个电极上; 和（ii）设置在绝缘体层之上的一叠电介质层。 电介质层的叠层包括：（a）至少一个介电层，包括氮氧化铝; 和（b）至少一个包括氧化硅和氮氧化硅中的至少一种的电介质层。

公开(公告)号：US12270104B2

公开(公告)日：2025-04-08

申请号：US17696101

申请日：2022-03-16

Applicant: ENTEGRIS, INC.

Inventor： Nilesh Gunda ,  Jayasri Narayanamoorthy ,  Carlo Waldfried

IPC: C23C16/56 ,  C23C14/08 ,  C23C16/40 ,  C23C16/455 ,  H01L21/02

Abstract: Described are substrates that include high aspect ratio surfaces and non-high aspect ratio surfaces, at least two coatings, one coating at high aspect ratio surfaces and a second coating at non-high aspect ratio surfaces, and having fluorinated outer surfaces; methods of preparing these coatings; and substrates, surfaces, equipment, and components of equipment that include the coatings.

公开(公告)号：US20240337023A1

公开(公告)日：2024-10-10

申请号：US18745963

申请日：2024-06-17

Applicant: ENTEGRIS, INC.

Inventor： I-Kuan Lin ,  Carlo Waldfried ,  Jianan Hou

IPC: C23C16/56 ,  C23C16/40 ,  C23C16/44 ,  C23C16/455

CPC classification number: C23C16/56 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/45525

Abstract: Articles and methods relating to coatings having superior chemical resistance and structural integrity, can be prepared via atomic layer deposition and fluoro-annealing at low process temperatures of between about 150° C. and less than 300° C. The film comprises a fluorinated metal oxide containing yttrium.

公开(公告)号：US12031212B2

公开(公告)日：2024-07-09

申请号：US17230742

申请日：2021-04-14

Applicant: ENTEGRIS, INC.

Inventor： Carlo Waldfried ,  Stephen Longo ,  Parul Tyagi

IPC: C23C16/56 ,  C23C16/02 ,  C23C16/40 ,  C23C16/44 ,  C23C16/455 ,  H01L21/02

CPC classification number: C23C16/56 ,  C23C16/0272 ,  C23C16/405 ,  C23C16/4404 ,  C23C16/45525 ,  H01L21/02 ,  Y10T428/265 ,  Y10T428/31678

Abstract: Described are yttrium fluoride compositions, including deposited films, e.g., coatings, that contain yttrium fluoride; methods of preparing yttrium fluoride compositions and deposited film coatings that contain yttrium fluoride; as well as substrates that have a deposited film coating that contains yttrium fluoride at a surface and methods and equipment that include the substrates.