Some embodiments include apparatuses and methods of forming the apparatuses. One of the apparatuses includes conductive materials located in different levels of the apparatus, dielectric materials located in different levels of the apparatus, a first conductive contact, and a second conductive contact. One of the conductive materials is between two of the dielectric materials. One of the dielectric materials is between two of the conductive materials. The first conductive contact has a length extending through the conductive materials and the dielectric materials in a direction perpendicular to the levels of the apparatus. The first conductive contact is electrically separated from the conductive materials. The second conductive contact contacts a group of conductive materials of the conductive materials.