Invention Application
- Patent Title: POWER MODULE WITH INTEGRATED LIQUID COOLING
-
Application No.: US15698722Application Date: 2017-09-08
-
Publication No.: US20190082561A1Publication Date: 2019-03-14
- Inventor: Debabrata Pal
- Applicant: HAMILTON SUNDSTRAND CORPORATION
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H02K11/33

Abstract:
A module has a first layer with a plurality of transistors mounted thereon. Circuit traces are configured to communicate current between the transistors outwardly of the module. A second layer is in operable communication with the first layer. A third layer is in operable communication with the second layer. A baseplate is in grounded communication with the third layer. A plurality of ribs are positioned between the third layer and the baseplate. The module is configured to allow fluid to flow between the third layer and the baseplate and around the plurality of ribs. A motor drive and a method are also disclosed.
Public/Granted literature
- US10292316B2 Power module with integrated liquid cooling Public/Granted day:2019-05-14
Information query