- 专利标题： Compliant Needle for Direct Transfer of Semiconductor Devices
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申请号： US16200419申请日： 2018-11-26
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公开(公告)号： US20190096727A1公开(公告)日： 2019-03-28
- 发明人: Justin Wendt , Cody Peterson , Clinton Adams , Sean Kupcow , Andrew Huska
- 申请人： Rohinni, LLC
- 专利权人： Rohinni, LLC
- 当前专利权人： Rohinni, LLC
- 主分类号： H01L21/677
- IPC分类号： H01L21/677 ; H01L21/687 ; H01L23/544 ; H01L21/683
摘要：
An apparatus includes a needle and a needle actuator to move the needle to a position at which the needle presses an electrically-actuatable element into contact with a circuit trace. When the needle presses the electrically-actuatable element into contact with the circuit trace, a dampener, arranged with the needle and the needle actuator, dampens a force applied to the electrically-actuatable element.
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