- 专利标题: Diamond-Like-Carbon Based Friction Reducing Tapes
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申请号: US16121752申请日: 2018-09-05
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公开(公告)号: US20190111661A1公开(公告)日: 2019-04-18
- 发明人: Lei Wang , Jeffrey R. Bailey , Srinivasan Rajagopalan , Adnan Ozekcin , Mehmet Deniz Ertas , Erika Biediger
- 申请人: Lei Wang , Jeffrey R. Bailey , Srinivasan Rajagopalan , Adnan Ozekcin , Mehmet Deniz Ertas , Erika Biediger
- 主分类号: B32B9/00
- IPC分类号: B32B9/00 ; B32B7/12 ; B32B15/04
摘要:
A multi-layer friction reducing tape, including: a foil layer including a metal, polymer, or hybrid-metal-polymer; an under layer disposed on the foil layer; an adhesion promoting layer contiguous with a surface of the under layer; a functional layer that includes a fullerene based composite, a diamond based material, diamond-like-carbon (DLC), or combinations thereof, wherein the functional layer is contiguous with a surface of the adhesion promoting layer; and a tape, including an adhesive layer and a backing material, wherein the adhesive layer is attached to a surface of the foil layer opposite the under layer.
公开/授权文献
- US11364705B2 Diamond-like-carbon based friction reducing tapes 公开/授权日:2022-06-21
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