A circuit system includes an integrated circuit package, first and second memory modules, and a base circuit board. The integrated circuit package houses a main integrated circuit die. The first memory module has a first circuit board and first memory integrated circuit dies coupled to the first circuit board. The second memory module has a second circuit board and second memory integrated circuit dies coupled to the second circuit board. The base circuit board is coupled to the integrated circuit package and to the first and second memory modules. The base circuit board includes conductors that couple the integrated circuit package to the first and second memory modules. The second memory module has a reverse orientation on the base circuit board relative to the first memory module such that the second memory integrated circuit dies face away from the first memory integrated circuit dies.