An IC package includes a magnetic detection element, multiple lead lines electrically connected to the magnetic detection element, and multiple terminal lines weldable to the lead lines respectively. A first welding portion, in which a first lead line of the multiple lead lines is welded to a first terminal line of the multiple terminal lines, is not on vertical lines that pass through second welding portions in which the second lead lines of the multiple lead lines are welded to the second terminal lines of the multiple terminal lines respectively. The second lead lines are adjacent to the first lead line. The vertical lines are orthogonal to center axes of the second lead lines.