公开(公告)号：US20180245953A1

公开(公告)日：2018-08-30

申请号：US15755234

申请日：2016-08-08

Applicant: DENSO CORPORATION

Inventor： Seiji NISHIMOTO ,  Tomoyuki TAKIGUCHI ,  Yoshiyuki KONO ,  Akitoshi MIZUTANI

IPC: G01D11/24 ,  G01D5/14

CPC classification number: G01D11/245 ,  G01D5/14 ,  G01D5/145 ,  G01R33/02 ,  H01L23/3107 ,  H01L23/3135

Abstract: A magnetic field detection device includes an IC package, a terminal, a resin mold member. The IC package includes a magnetism detection element, a lead frame located on a first side of the magnetism detection element, and a resin member covering the magnetism detection element and the lead frame. The resin mold member includes a base portion and a head portion. The head portion includes a thickest portion. An outer wall surface of the thickest portion located on a second side of the magnetism detection element is a detection reference surface. An element corresponding surface that is an outer wall surface of the IC package located on the second side is exposed to an outside of resin mold member or covered with a detection side thin portion thinner than a thickness from the element corresponding surface to the detection side reference surface.

公开(公告)号：US20170345998A1

公开(公告)日：2017-11-30

申请号：US15603733

申请日：2017-05-24

Applicant: DENSO CORPORATION ,  TDK-MICRONAS GMBH

Inventor： Toshiyuki KOUMORI ,  Yoshiyuki KONO ,  Tomoyuki TAKIGUCHI ,  Yoshinori INUZUKA ,  Akitoshi MIZUTANI ,  Seiji NISHIMOTO ,  Camillo PILLA

IPC: H01L43/04 ,  H01L43/14 ,  H01L43/06

CPC classification number: H01L43/04 ,  H01L23/48 ,  H01L43/065 ,  H01L43/14 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method for manufacturing semiconductor devices is provided. The method includes bonding a semiconductor element to a first surface of a planar lead frame, clamping a partial area of the lead frame to hold the lead frame and the semiconductor element in molding dies, and covering at least a part of the lead frame and the semiconductor element with a resin member by resin molding which fills the molding dies with resin. A thin-walled portion having a relative small thickness is previously formed on a shortest virtual line connecting a clamp area of the lead frame to an area where the semiconductor element is bonded.

公开(公告)号：US20200300922A1

公开(公告)日：2020-09-24

申请号：US16892791

申请日：2020-06-04

Applicant: DENSO CORPORATION

Inventor： Takasuke ITO ,  Yoshiyuki KONO ,  Tomoyuki TAKIGUCHI

IPC: G01R31/40 ,  G01R31/52

Abstract: An output terminal of a signal output device is connected through a branch path to a voltage dividing point in a main path, and transmits an output signal based on a voltage of the voltage dividing point to an outside. A signal generation circuit adjusts the voltage of the voltage dividing point and generates the output signal. A short circuit detection circuit detects a short circuit between the output terminal and another terminal when a current flowing in the branch path is greater than a predetermined short circuit detection threshold. A switching circuit switches a current carrying capacity or a configuration of the signal generation circuit to limit a short circuit current flowing in the branch path when the short circuit is detected. The short circuit current is set to a value equal to or greater than the short circuit detection threshold and less than a current upper limit value.

公开(公告)号：US20200235763A1

公开(公告)日：2020-07-23

申请号：US16844218

申请日：2020-04-09

Applicant: DENSO CORPORATION

Inventor： Takasuke ITO ,  Yoshiyuki KONO ,  Tomoyuki TAKIGUCHI

IPC: H04B1/04 ,  G08C25/00

Abstract: A communication apparatus operates with a supply voltage of a power and transmits a sensor value with a digital communication method using consecutive frames. In the communication apparatus, a data source unit is configured to generate a frame using a data of a sensor value processed by a signal processing unit. A switching unit is configured to perform a signal switching to permit a transmission circuit to perform a re-transmission of re-transmitting a signal including the sensor value stored in a memory in response to a restoration of the power after an instantaneous power interruption. A frame monitoring unit is configured to monitor a status of a frame transmission and determine a frame at the occurrence of the instantaneous power interruption. The sensor value to be re-transmitted is determined based on information of the frame determined by the frame monitoring unit at the occurrence of the instantaneous power interruption.

公开(公告)号：US20140111193A1

公开(公告)日：2014-04-24

申请号：US14025877

申请日：2013-09-13

Applicant: DENSO CORPORATION

Inventor： Takehito MIZUNUMA ,  Tomoyuki TAKIGUCHI ,  Akitoshi MIZUTANI ,  Yoshiyuki KONO

IPC: G01D5/12

CPC classification number: G01D5/12 ,  G01D3/028 ,  G01D5/145

Abstract: In a rotation angle detecting device, a signal from a first magnetism detecting element is outputted to a signal output part of a first IC package. A first signal output terminal outputs the signal from the first magnetism detecting element to outside. A signal from a second magnetism detecting element is outputted to a signal output part of a second IC package. A second signal output terminal outputs the signal from the second magnetism detecting element to outside. At least one of a power supply terminal and a ground terminal is located between the first and second signal output terminals. A rotary drive unit includes the device, a motor that rotates a detection object, and a motor power source wire. The ground terminal and a motor power source terminal are adjacent to each other.

Abstract translation: 在旋转角检测装置中，来自第一磁检测元件的信号被输出到第一IC封装的信号输出部分。 第一信号输出端子将来自第一磁检测元件的信号输出到外部。 来自第二磁检测元件的信号被输出到第二IC封装的信号输出部分。 第二信号输出端子将来自第二磁检测元件的信号输出到外部。 电源端子和接地端子中的至少一个位于第一和第二信号输出端子之间。 旋转驱动单元包括该装置，旋转检测对象的马达和马达电源线。 接地端子和电机电源端子彼此相邻。

公开(公告)号：US20140077794A1

公开(公告)日：2014-03-20

申请号：US13970906

申请日：2013-08-20

Applicant: DENSO CORPORATION

Inventor： Tomoyuki TAKIGUCHI ,  Takehito MIZUNUMA ,  Yoshiyuki KONO

IPC: G01B7/00

CPC classification number: G01B7/003 ,  G01D5/145 ,  G01D11/245

Abstract: A position detection device includes a first component provided by molding of a first mold resin with a first hall IC, a second component provided by molding of a second mold resin with a second hall IC, a terminal connected to a first wiring of the first component and to a second wiring of the second component, and a third mold resin molded to hold and protect the first component, the second component and the terminal. The third mold resin fixing the first component and the second component to each other. Accordingly, the position detection device can be provided, which includes a component usable commonly for a variety of position detection devices which are different in the number of hall ICs.

Abstract translation: 位置检测装置包括通过模制具有第一霍尔IC的第一模制树脂提供的第一部件，通过用第二霍尔IC模制第二模制树脂而提供的第二部件，连接到第一部件的第一布线的端子 以及第二部件的第二布线，以及模制成保持和保护第一部件，第二部件和端子的第三模制树脂。 第三模具树脂将第一部件和第二部件彼此固定。 因此，可以提供位置检测装置，该装置包括对于多个位置检测装置可共同使用的，不同于厅厅IC数量的部件。

公开(公告)号：US20190170499A1

公开(公告)日：2019-06-06

申请号：US16267646

申请日：2019-02-05

Applicant: DENSO CORPORATION

Inventor： Takasuke ITO ,  Yoshiyuki KONO ,  Tomoyuki TAKIGUCHI ,  Sadahito FUKUMORI

IPC: G01B7/30 ,  G01D5/245 ,  G01D11/24 ,  G01D5/14 ,  H01R43/02

Abstract: A position detection device is configured to detect a position of a detection target. The position detection device includes: an IC package including a magnetic detection element configured to output a signal that depend on a direction or a strength of an ambient magnetic field, a sealing portion in which the magnetic detection element is sealed, and lead lines, which are projected from the sealing portion and are electrically connected to the magnetic detection elements; terminal lines electrically connectable to the lead lines respectively; and a lead guide placed along the lead lines to restrict positional deviation of the lead lines.

公开(公告)号：US20150061657A1

公开(公告)日：2015-03-05

申请号：US14470387

申请日：2014-08-27

Applicant: DENSO CORPORATION

Inventor： Tomoyuki TAKIGUCHI ,  Ninh Duc HOANG ,  Yoshiyuki KONO ,  Takehito MIZUNUMA

IPC: G01B7/30 ,  B29C45/14 ,  B29C45/26 ,  G01R33/07 ,  G01B7/00

CPC classification number: B29C45/14655 ,  B29C2045/14672 ,  B29K2905/00 ,  B29K2995/0097 ,  B29L2031/3406 ,  F02D41/28 ,  F02D2200/0404 ,  G01D5/145 ,  G01R33/07

Abstract: A position detector apparatus includes a detector part, wiring, a resin part, a resin body, a terminal, and a lead frame. The resin part has a thickness at a wiring side portion of the detector part that is greater than a thickness on a side opposite to the wiring side portion. Therefore, when injection-molding the resin part, due to a thickness change of the resin part, the detector part is pressed against a metal mold and a position of the detecting part is fixed. Further, the resin body has a thick-resin portion and a thin-resin portion. The thickness of the thin-resin portion allows a predetermined amount of dislocation of the detector part. Therefore, if the detector part is exposed, water is prevented from intruding the lead frame and the terminal.

Abstract translation: 位置检测器装置包括检测器部分，布线，树脂部分，树脂体，端子和引线框架。 树脂部分在检测器部分的布线侧部分的厚度大于与布线侧部分相反的一侧的厚度。 因此，当注射成型树脂部件时，由于树脂部件的厚度变化，检测器部分被压在金属模具上，并且检测部件的位置被固定。 此外，树脂体具有厚树脂部分和薄树脂部分。 薄树脂部分的厚度允许检测器部分的预定量的位错。 因此，如果检测器部分被暴露，则防止水侵入引线框架和端子。

公开(公告)号：US20140306696A1

公开(公告)日：2014-10-16

申请号：US14190626

申请日：2014-02-26

Applicant: DENSO CORPORATION

Inventor： Takehito MIZUNUMA ,  Tomoyuki TAKIGUCHI ,  Takamitsu KUBOTA ,  Yoshiyuki KONO

IPC: G01D5/14

CPC classification number: G01D5/14 ,  G01D5/145 ,  G01D5/2448

Abstract: A magnetism sensing element is provided to be rotatable relative to permanent magnets and outputs a magnetic force detection value, which corresponds to a perpendicular component of magnetic flux. A Hall IC calculates and outputs an output voltage, which corresponds to a relative rotational angle between the permanent magnets and the magnetism sensing element, based on the magnetic force detection value outputted by the magnetism sensing element. The Hall IC calculates the output voltage as V2=k×arcsin(V1/(VM+α))+Voffset, in which V1, V2, VM, k, α and Voffset indicate the magnetic force detection value, the output voltage, a maximum value of the magnetic force detection value, a gain, a predetermined value and a predetermined offset value.

Abstract translation: 磁传感元件能够相对于永磁体旋转，并输出对应于磁通的垂直分量的磁力检测值。 霍尔IC基于由磁感测元件输出的磁力检测值来计算并输出与永磁体和磁感测元件之间的相对旋转角度对应的输出电压。 霍尔IC计算输出电压为V2 = k×arcsin（V1 /（VM +α））+ Voffset，其中V1，V2，VM，k，α和Voffset表示磁力检测值，输出电压a 磁力检测值的最大值，增益，预定值和预定的偏移值。

公开(公告)号：US20200340834A1

公开(公告)日：2020-10-29

申请号：US16924353

申请日：2020-07-09

Applicant: DENSO CORPORATION

Inventor： Yoshinori INUZUKA ,  Yoshiyuki KONO ,  Hidekazu WATANABE ,  Tomoyuki TAKIGUCHI ,  Takasuke ITO

IPC: G01D5/244 ,  G01D5/245

Abstract: A rotation angle detection device for detecting a rotation angle of a rotating body includes a magnet disposed to rotate together with the rotating body, a magnetic portion provided in a ring shape radially outward of the magnet, a plurality of gaps being formed in the magnetic portion at a plurality of locations along a circumferential direction, and a magnetic detection unit arranged in a particular gap of the plurality of gaps. The magnetic detection unit is located at a detection position, a width of the particular gap in the tangential direction at the detection position is defined as a detection position gap width, a width of the particular gap in the tangential direction at a position radially outward of the detection position is defined as a tangential width, and the tangential width is narrower than the detection position gap width.