A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is formed with metal circuits by screen printing. Electronic elements are adhered on the metal layer to form as circuits with specific functions. Materials of the adhering layer contains Organic silicon polyester copolymer resin, Ethyl acetate and Organic silicon resin. Material of the metal layer is selected from copper, aluminum, sliver, and gold. A packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. Material of the metal layer is selected from copper, aluminum, sliver, and gold.