摘要:
A circuit board with a substrate made of silicone comprises a silicone substrate made of silicone; an adhering layer adhered on the silicone substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is etched to form with metal circuits. Furthermore, electronic elements are adhered on the metal layer to form as circuits. A packaging silicone layer encapsulates the metal layer and the electronic elements for packaging. The circuit board is a flat plate board or a curled board. The silicone are known as polysiloxanes, and are polymer that includes any synthetic compound made up of repeating unit of siloxane, which is a chain of alternating silicon atoms and oxygen atoms, combined with carbon, hydrogen, and sometimes other elements. The silicone is not silicon atoms as those used in wafer.
摘要:
A circuit board with a substrate made of silicon includes a a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer. Furthermore, the method for forming the circuit board with silicon substrate is proposed, in that a method for forming a circuit board suitable for etching and a method for forming a circuit board for screen printing are proposed.
摘要:
A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer; and wherein the metal layer is formed with metal circuits by screen printing. Electronic elements are adhered on the metal layer to form as circuits with specific functions. Materials of the adhering layer contains Organic silicon polyester copolymer resin, Ethyl acetate and Organic silicon resin. Material of the metal layer is selected from copper, aluminum, sliver, and gold. A packaging silicon layer encapsulates the metal layer and the electronic elements for packaging. Material of the metal layer is selected from copper, aluminum, sliver, and gold.
摘要:
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.
摘要:
A crank structure for a bicycle pedal. A front outer thread of a cylindrical sleeve has a same rotary direction as an inner thread hole of the crank, and the rear outer thread has the opposite rotary direction to that of the front outer thread. The inner thread rotary direction of the cylindrical sleeve is the same as that of an outer thread of a bolt protruding from a pedal, and opposite edges of the two each has a hole, so that after the front outer thread of the cylindrical sleeve is secured to the thread of a threaded hole in the crank. A nut is used to lock the rear outer thread in order to limit the rotation. The bolt is locked into the inner thread of the hole of the cylindrical sleeve for the assembly in order to attain the effects of securely mounting and easily detaching the crank structure.
摘要:
A circuit board with a substrate made of silicon includes a silicon substrate made of silicon; an adhering layer which is a gluing layer and is adhered on the silicon substrate; and a metal layer formed as a metal plate layer or a metal circuit layer; the metal layer being adhered on the adhering layer. Furthermore, the method for forming the circuit board with silicon substrate is proposed, in that a method for forming a circuit board suitable for etching and a method for forming a circuit board for screen printing are proposed.
摘要:
In a reflow process, a plurality of solder bumps between a first workpiece and a second workpiece is melted. During a solidification stage of the plurality of solder bumps, the plurality of solder bumps is cooled at a first cooling rate. After the solidification stage is finished, the plurality of solder bumps is cooled at a second cooling rate lower than the first cooling rate.
摘要:
A service providing apparatus, a service consuming apparatus, and a service transmitting method are provided. The service providing apparatus is adapted to connect with the service consuming apparatus via a wireless network. Within a control channel period, the service providing apparatus schedules the services with the service consuming apparatus. Within a service channel period, the service providing apparatus provides a service resource to the service consuming apparatus according to the result of scheduling the services. If the service consuming apparatus does not send a service request signal to the service providing apparatus within the control channel period, the service consuming apparatus has to remain silent within the service control channel. By the arrangement, the problems caused from the characteristic of the link asymmetry of the wireless network can be solved.
摘要:
A service providing apparatus, a service consuming apparatus, and a service transmitting method thereof are provided. The service providing apparatus is able to pre-allocate a plurality of service consuming apparatus into different groups, to pre-schedule the groups in a control channel, and to pre-schedule the groups in at least one channel. Accordingly, the channel resource can be consumed more efficiently by the service consuming apparatus.