发明申请
- 专利标题: PRINTED WIRING BOARD
-
申请号: US16232144申请日: 2018-12-26
-
公开(公告)号: US20190198446A1公开(公告)日: 2019-06-27
- 发明人: Yoji SAWADA
- 申请人: IBIDEN CO., LTD.
- 申请人地址: JP Ogaki-shi
- 专利权人: IBIDEN CO., LTD.
- 当前专利权人: IBIDEN CO., LTD.
- 当前专利权人地址: JP Ogaki-shi
- 优先权: JP2017-247514 20171225
- 主分类号: H01L23/538
- IPC分类号: H01L23/538 ; H01L25/18 ; H01L23/498 ; H01L23/00
摘要:
A printed wiring board includes a core substrate, and a build-up layer formed on the substrate. The substrate includes core material, third conductor layer, fourth conductor layer, and through-hole conductors. The build-up layer is formed on the core material and third conductor layer and includes insulating layers, first conductor layers, and via conductors. The build-up layer has central area and outer peripheral area such that the via conductors include central area via conductors and outer peripheral area via conductors, diameter of central area via conductor is smaller than diameter of outer peripheral area via conductor, the outermost first conductor layer includes first pads to mount first electronic component and second pads to mount second electronic component, the first and second pads are connected to each other via the central via conductors, and the lowermost insulating layer does not have the via conductors in the central area of the build-up layer.