Invention Application
- Patent Title: ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE
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Application No.: US16298459Application Date: 2019-03-11
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Publication No.: US20190204736A1Publication Date: 2019-07-04
- Inventor: Kazuhiro MARUMO , Naohiro TANGO
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2016-196521 20161004
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; G03F7/20

Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition is an actinic ray-sensitive or radiation-sensitive resin composition including a resin A whose solubility in an alkali developer increases by the action of an acid, a compound B that generates an acid upon irradiation with actinic rays or radiation, a resin C that has a surface energy of more than 25 mJ/m2 and has at least one of a fluorine atom or a silicon atom and a polarity conversion group, and a resin D that has a surface energy of 25 mJ/m2 or less, in which the content of the resin D is 1.1% by mass or more with respect to the total solid content of the actinic ray-sensitive or radiation-sensitive resin composition.
Information query
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