Invention Application
- Patent Title: On-Chip Antennas for Semiconductor Devices and Related Manufacturing Methods
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Application No.: US16360387Application Date: 2019-03-21
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Publication No.: US20190221531A1Publication Date: 2019-07-18
- Inventor: Thorsten Meyer , Walter Hartner , Maciej Wojnowski
- Applicant: Infineon Technologies AG
- Priority: DE102016107678.3 20160426
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/31 ; H01L23/522 ; H01Q1/22 ; H01L29/06 ; H01L23/00
Abstract:
A semiconductor device includes a semiconductor die having an active main surface and an opposite main surface opposite the active main surface. The semiconductor device further includes an antenna arranged on the active main surface of the semiconductor die and a recess arranged on the opposite main surface of the semiconductor die. The recess is arranged over the antenna.
Public/Granted literature
- US12094842B2 Semiconductor device having an antenna arranged over an active main surface of a semiconductor die Public/Granted day:2024-09-17
Information query
IPC分类:
