- 专利标题： SEMICONDUCTOR DEVICE WITH TIERED PILLAR AND MANUFACTURING METHOD THEREOF
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申请号： US16378741申请日： 2019-04-09
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公开(公告)号： US20190237343A1公开(公告)日： 2019-08-01
- 发明人: Ronald Patrick Huemoeller , Michael G. Kelly , Curtis Zwenger
- 申请人： Amkor Technology, Inc.
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/00 ; H01L21/56 ; H01L25/00 ; H01L23/538 ; H01L23/31 ; H01L21/683 ; H01L25/10
摘要：
A semiconductor device having one or more tiered pillars and methods of manufacturing such a semiconductor device are disclosed. The semiconductor device may include redistribution layers, a semiconductor die, and a plurality of interconnection structures that operatively couple a bottom surface of the semiconductor die to the redistribution layers. The semiconductor device may further include one or more conductive pillars about a periphery of the semiconductor die. The one or more conductive pillars may be electrically connected to the redistribution layers and may each comprise a plurality of stacked tiers.
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