- 专利标题: HEAT FLUX SENSOR MODULE AND METHOD OF MANUFACTURING SAME
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申请号: US16314693申请日: 2017-06-26
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公开(公告)号: US20190250049A1公开(公告)日: 2019-08-15
- 发明人: Toshikazu HARADA , Atusi SAKAIDA , Toshihisa TANIGUCHI , Norio GOUKO , Keiji OKAMOTO
- 申请人: DENSO CORPORATION
- 优先权: JP2016-132563 20160704
- 国际申请: PCT/JP2017/023352 WO 20170626
- 主分类号: G01K17/20
- IPC分类号: G01K17/20 ; G01J5/12 ; B29C65/00
摘要:
A heat flux sensor module includes: a first film including a first surface; a plurality of sensor chips which are disposed spaced apart from each other on the first surface and detect heat flux; a second film stacked on the first surface of the first film so that the plurality of sensor chips are sandwiched between the first film and the second film; and a heat conducting member which is disposed between adjacent sensor chips and has higher heat conductivity than air. The heat conducting member is in contact with both the first film and the second film.
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