- 专利标题: PRINTED AND/OR THIN FILM INTEGRATED CIRCUIT WITH INTEGRATED ANTENNA, AND METHODS OF MAKING AND USING THE SAME
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申请号: US16287126申请日: 2019-02-27
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公开(公告)号: US20190267698A1公开(公告)日: 2019-08-29
- 发明人: Somnath MUKHERJEE , Aditi CHANDRA , Mao ITO , Arvind KAMATH , Scott BRUNER , Sambhu KUNDU , Anand DESHPANDE
- 申请人: Somnath MUKHERJEE , Aditi CHANDRA , Mao ITO , Arvind KAMATH , Scott BRUNER , Sambhu KUNDU , Anand DESHPANDE
- 申请人地址: NO Oslo
- 专利权人: Thin Film Electronics ASA
- 当前专利权人: Thin Film Electronics ASA
- 当前专利权人地址: NO Oslo
- 主分类号: H01Q1/22
- IPC分类号: H01Q1/22 ; H01L23/532 ; H01L23/66 ; H01L23/64 ; H01L23/522 ; H01L23/528
摘要:
A wireless communication device having an integrated antenna, and methods for making and using the same are disclosed. The device generally includes (a) a substrate; (b) an integrated circuit (IC) comprising a plurality of printed and/or thin film layers and/or structures on the substrate, (c) a dielectric or insulator layer in at least one area of the substrate other than the IC; and (d) an antenna on the dielectric or insulator layer, comprising one or more metal traces. The plurality of printed and/or thin film layers and/or structures include an uppermost layer of metal. The antenna has (i) an inner terminal continuous with the uppermost layer of metal or connected to the uppermost layer of metal through one or more contacts, and (ii) an outer terminal connected to the uppermost layer of metal through one or more contacts and optionally a metal bridge or strap
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