A laser module includes an encapsulating support, at least one laser, a sealing gasket, and a pressing plate. Each laser includes a supporting plate and a laser body that is fixed to the supporting plate. The supporting plate is fixed on the encapsulating support, and a surface of an end of the laser body away from the supporting plate is a light exit end face. The sealing gasket is located on a surface of the supporting plate close to the light exit end face, and the sealing gasket has a first opening at a position corresponding to the laser body. A pressing plate is located on a surface of the sealing gasket away from the supporting plate; the pressing plate is fixedly connected to the encapsulating support, and the pressing plate has a second opening at a position corresponding to the first opening.