A chip connection method and structure are provided. The method includes: providing a first connection line and a second connection line on a substrate, wherein, in the thickness direction of the substrate, a distance between the first connection line and the chip is smaller than a distance between the second connection line and the chip providing the chip on a top surface of the substrate, the chip being provided with at least two chip pins; and providing the substrate with a second through hole corresponding to the second connecting line, and provided therein with a second conductive layer, at least one chip pin being electrically connected to the first connection line, and at least one of the remaining chip pin being corresponding to a first opening of the second through hole, and the second conductive layer electrically connecting the chip pin and the second connection line.