Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
-
Application No.: US16438769Application Date: 2019-06-12
-
Publication No.: US20190296046A1Publication Date: 2019-09-26
- Inventor: Shinya ARAI
- Applicant: Toshiba Memory Corporation
- Applicant Address: JP Minato-ku
- Assignee: Toshiba Memory Corporation
- Current Assignee: Toshiba Memory Corporation
- Current Assignee Address: JP Minato-ku
- Priority: JP2017-036973 20170228
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; G11C16/14 ; H01L27/11524 ; H01L27/1157 ; H01L27/11548 ; H01L27/11575 ; H01L21/764 ; H01L29/06 ; H01L27/11573

Abstract:
According to one embodiment, a source layer includes a semiconductor layer including an impurity. A stacked body includes a plurality of electrode layers stacked with an insulator interposed. A gate layer is provided between the source layer and the stacked body. The gate layer is thicker than a thickness of one layer of the electrode layers. A semiconductor body extends in a stacking direction of the stacked body through the stacked body and the gate layer. The semiconductor body further extends in the semiconductor layer where a side wall portion of the semiconductor body contacts the semiconductor layer. The semiconductor body does not contact the electrode layers and the gate layer.
Public/Granted literature
- US10651199B2 Semiconductor device and method for manufacturing same Public/Granted day:2020-05-12
Information query
IPC分类: