- 专利标题： ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
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申请号： US15941809申请日： 2018-03-30
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公开(公告)号： US20190304805A1公开(公告)日： 2019-10-03
- 发明人: Jiongxin Lu , Aravindha Antoniswamy , Jinlin Wang , Ashutosh Srivastava
- 申请人： Intel Corporation
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/498
摘要：
An electronic package including a substrate. The substrate includes a first solder material that is applied adjacent a periphery of the substrate. The substrate also includes a second solder material having properties different than the first solder material that is applied adjacent a periphery of a keep in zone of the substrate.
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