Invention Application
- Patent Title: ENCAPSULATED VERTICAL INTERCONNECTS FOR HIGH-SPEED APPLICATIONS AND METHODS OF ASSEMBLING SAME
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Application No.: US16279656Application Date: 2019-02-19
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Publication No.: US20190304885A1Publication Date: 2019-10-03
- Inventor: Bok Eng Cheah , Jackson Chung Peng Kong , Kool Chi Ooi , Yang Liang Poh
- Applicant: Intel Corporation
- Priority: MYPI2018701318 20180330
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48
Abstract:
A semiconductor package substrate includes an encapsulated interconnect on a land side of the substrate. The encapsulated interconnect includes an integral metallic structure that has a smaller contact end against the semiconductor package substrate, and a larger contact end for board mounting.
Public/Granted literature
- US11049801B2 Encapsulated vertical interconnects for high-speed applications and methods of assembling same Public/Granted day:2021-06-29
Information query
IPC分类:
