Invention Application
- Patent Title: SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US15970536Application Date: 2018-05-03
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Publication No.: US20190341505A1Publication Date: 2019-11-07
- Inventor: Chanyuan LIU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L31/02 ; H01L31/0232 ; H01L31/173 ; H01L31/18

Abstract:
A semiconductor device package includes a substrate, a first encapsulant and a second encapsulant. The substrate has an optical region and a surface-mount technology (SMT) device region. The first encapsulant includes a first portion disposed on the optical region and covers the optical region and a second portion disposed on the SMT device region and covers the SMT device region. The second encapsulant is disposed on the substrate and covers at least a portion of the second portion of the first encapsulant and a portion of the first portion of the first encapsulant.
Public/Granted literature
- US10930802B2 Semiconductor device package and method of manufacturing the same Public/Granted day:2021-02-23
Information query
IPC分类: