- 专利标题: METHOD FOR MANUFACTURING ELECTRONIC COMPONENT WITH COIL
-
申请号: US16545618申请日: 2019-08-20
-
公开(公告)号: US20190371524A1公开(公告)日: 2019-12-05
- 发明人: Shinichi SAKAMOTO , Douglas James MALCOLM
- 申请人: SUMIDA CORPORATION
- 主分类号: H01F41/064
- IPC分类号: H01F41/064 ; H01F17/04 ; H01F27/29 ; H01F27/255 ; H01F41/02 ; H01F27/02 ; H01F27/24 ; H01F27/28
摘要:
A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.
公开/授权文献
- US10529485B2 Method for manufacturing electronic component with coil 公开/授权日:2020-01-07