Invention Application
- Patent Title: THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED PART INCLUDING THE SAME
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Application No.: US16302038Application Date: 2017-11-01
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Publication No.: US20190382574A1Publication Date: 2019-12-19
- Inventor: Yong Hee AN , Yong Yeon HWANG , Hyun Taek OH , Bong Keun AHN , Min Jung KIM , Chun Ho PARK , Eun Soo KANG , Jang Won PARK
- Applicant: LG CHEM, LTD.
- Priority: KR10-2016-0146832 20161104; KR10-2017-0117722 20170914
- International Application: PCT/KR2017/012237 WO 20171101
- Main IPC: C08L33/06
- IPC: C08L33/06 ; C08J3/20 ; C08J5/18

Abstract:
A thermoplastic resin composition with low gloss and improved colorability, pencil hardness and wear resistance has (A) 5 to 35% by weight of a first graft copolymer having an average particle diameter of 50 to 150 nm and containing acrylate rubber as a core; (B) 10 to 40% by weight of a second graft copolymer having an average particle diameter of more than 150 nm and 800 nm or less and containing acrylate rubber as a core; (C) 5 to 15% by weight of an aromatic vinyl compound-vinyl cyanide compound copolymer having a weight average molecular weight of 70,000 to 130,000 g/mol; (D) 20 to 50% by weight of an aromatic vinyl compound-(meth)acrylate compound copolymer having a weight average molecular weight of 65,000 to 100,000 g/mol; and (E) 0.1 to 7% by weight of a syndiotactic polystyrene resin.
Information query