Invention Application
- Patent Title: SEMICONDUCTOR DEVICES HAVING CONTACT PLUGS OVERLAPPING ASSOCIATED BITLINE STRUCTURES AND CONTACT HOLES
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Application No.: US16553840Application Date: 2019-08-28
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Publication No.: US20190386009A1Publication Date: 2019-12-19
- Inventor: Jun-Kyum KIM , Jung-Woo SEO , Sung-Un KWON
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: KR10-2014-0109042 20140821
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L21/768
Abstract:
A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.
Public/Granted literature
- US10573653B2 Semiconductor devices having contact plugs overlapping associated bitline structures and contact holes Public/Granted day:2020-02-25
Information query
IPC分类:
