公开(公告)号：US20190386009A1

公开(公告)日：2019-12-19

申请号：US16553840

申请日：2019-08-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum KIM ,  Jung-Woo SEO ,  Sung-Un KWON

IPC: H01L27/108 ,  H01L21/768

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

公开(公告)号：US20200176455A1

公开(公告)日：2020-06-04

申请号：US16782213

申请日：2020-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum KIM ,  Jung-Woo SEO ,  Sung-Un KWON

IPC: H01L27/108 ,  H01L21/768

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.

公开(公告)号：US20180019246A1

公开(公告)日：2018-01-18

申请号：US15716230

申请日：2017-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jun-Kyum KIM ,  Jung-Woo SEO ,  Sung-Un KWON

IPC: H01L27/108 ,  H01L21/768

CPC classification number: H01L27/10885 ,  H01L21/76879 ,  H01L27/10814 ,  H01L27/10817 ,  H01L27/10823 ,  H01L27/10855 ,  H01L27/10876 ,  H01L27/10891

Abstract: A semiconductor device can include a plurality of landing pads arranged according to a layout on a substrate, wherein a cross-sectional shape of each of the landing pads has a diamond shape so that opposing interior angles of the diamond shape are equal to one another and adjacent interior angles of the diamond shape are unequal to one another.