Invention Application
- Patent Title: THIN FILM CAPACITOR, MANUFACTURING METHOD THEREFOR, AND MULTILAYER CIRCUIT BOARD EMBEDDED WITH THIN FILM CAPACITOR
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Application No.: US16436559Application Date: 2019-06-10
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Publication No.: US20190392992A1Publication Date: 2019-12-26
- Inventor: Michihiro KUMAGAE , Kazuhiro YOSHIKAWA , Shigeaki TANAKA , Hitoshi SAITA
- Applicant: TDK CORPORATION
- Applicant Address: JP TOKYO
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP TOKYO
- Priority: JP2018-117393 20180620; JP2019-073256 20190408
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01L21/48 ; H01L23/498 ; H05K1/09 ; H05K1/11 ; H05K1/16 ; H05K3/46 ; H01L49/02

Abstract:
Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second through holes, a first metal film provided on one surface of the capacitive insulating film, and a second metal film provided on the other surface of the capacitive insulating film. The first and second metal films are made of different metal materials from each other. The first metal film is divided into a first area positioned outside the first space and a second area positioned inside the first space. The second metal film is divided into a third area positioned outside the second space and a fourth area positioned inside the second space. The third area is connected to the second area through the first through hole. The fourth area is connected to the first area through the second through hole.
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