Invention Application
- Patent Title: SOLID STATE IMAGING ELEMENT AND ELECTRONIC DEVICE
-
Application No.: US16563582Application Date: 2019-09-06
-
Publication No.: US20200006407A1Publication Date: 2020-01-02
- Inventor: Sozo Yokogawa
- Applicant: SONY CORPORATION
- Applicant Address: JP TOKYO
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP TOKYO
- Priority: JP2014-120205 20140611
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/028 ; H01L31/0376

Abstract:
The present disclosure relates to a solid state imaging element and an electronic device that make it possible to improve sensitivity to light on a long wavelength side. A solid state imaging element according to a first aspect of the present disclosure has a solid state imaging element in which a large number of pixels are arranged vertically and horizontally, the solid state imaging element includes a periodic concave-convex pattern on a light receiving surface and an opposite surface to the light receiving surface of a light absorbing layer as a light detecting element. The present disclosure can be applied to, for example, a CMOS and the like installed in a sensor that needs a high sensitivity to light belonging to a region on the long wavelength side, such as light in the infrared region.
Public/Granted literature
- US11329080B2 Solid state imaging element and electronic device Public/Granted day:2022-05-10
Information query
IPC分类: