Invention Application
- Patent Title: GLASS CERAMIC ANTENNA PACKAGE
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Application No.: US16022851Application Date: 2018-06-29
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Publication No.: US20200006846A1Publication Date: 2020-01-02
- Inventor: Jon LASITER , Seong Heon JEONG , Ravindra Vaman SHENOY , Jeremy Darren DUNWORTH , Mohammad Ali TASSOUDJI
- Applicant: QUALCOMM Incorporated
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H05K1/03 ; H01Q1/22

Abstract:
Certain aspects of the present disclosure provide a glass ceramic antenna package having a large bandwidth (e.g., 19 GHz) for millimeter wave (mmWave) applications, for example. The antenna package generally includes an antenna element comprising a first substrate layer and a second substrate layer, wherein the first substrate layer comprises an antenna, wherein the second substrate layer comprises shielding elements and feed lines, and wherein the feed lines are electrically coupled to the antenna. The antenna package also includes a lead frame adjacent to one or more lateral surfaces of the antenna element.
Public/Granted literature
- US11223116B2 Glass ceramic antenna package Public/Granted day:2022-01-11
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