Invention Application
- Patent Title: COOLING ELECTRONIC DEVICES IN A DATA CENTER
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Application No.: US16575953Application Date: 2019-09-19
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Publication No.: US20200015388A1Publication Date: 2020-01-09
- Inventor: Soheil Farshchian , Kenneth Dale Shaul
- Applicant: Google LLC
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; H01L23/473

Abstract:
A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.
Public/Granted literature
- US11419246B2 Cooling electronic devices in a data center Public/Granted day:2022-08-16
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