Invention Application
- Patent Title: HEADPHONE EARCUP MOUNT IN CONTINUOUS HEADBAND-SPRING HEADPHONE SYSTEM
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Application No.: US16059678Application Date: 2018-08-09
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Publication No.: US20200053463A1Publication Date: 2020-02-13
- Inventor: Bennett P. Daley , Eric Douglas Curtiss , Allen Timothy Graff , Richard Arthur Grebe
- Applicant: Bose Corporation
- Main IPC: H04R5/033
- IPC: H04R5/033 ; H04R1/10

Abstract:
Various implementations include headphone systems. In one implementation a headband for a headphone system includes: a continuous spring section sized to extend over a head of a user; an earcup mount coupled with an end of the continuous spring section, where the continuous spring section and the earcup mount form an arcuate joint, and where the earcup mount is configured to rotate relative to the continuous spring section at the arcuate joint; and a friction assembly spanning between the continuous spring section and the earcup mount, the friction assembly linearly arranged across the arcuate joint and configured to provide a substantially constant resistance to the rotation of the earcup mount relative to the continuous spring section.
Public/Granted literature
- US10743106B2 Headphone earcup mount in continuous headband-spring headphone system Public/Granted day:2020-08-11
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