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    HEADPHONE EARCUP MOUNT IN CONTINUOUS HEADBAND-SPRING HEADPHONE SYSTEM
    2.
    发明申请
    HEADPHONE EARCUP MOUNT IN CONTINUOUS HEADBAND-SPRING HEADPHONE SYSTEM 审中-公开

    公开(公告)号：US20200053463A1

    公开(公告)日：2020-02-13

    申请号：US16059678

    申请日：2018-08-09

    Applicant: Bose Corporation

    Inventor： Bennett P. Daley ,  Eric Douglas Curtiss ,  Allen Timothy Graff ,  Richard Arthur Grebe

    IPC: H04R5/033 ,  H04R1/10

    Abstract: Various implementations include headphone systems. In one implementation a headband for a headphone system includes: a continuous spring section sized to extend over a head of a user; an earcup mount coupled with an end of the continuous spring section, where the continuous spring section and the earcup mount form an arcuate joint, and where the earcup mount is configured to rotate relative to the continuous spring section at the arcuate joint; and a friction assembly spanning between the continuous spring section and the earcup mount, the friction assembly linearly arranged across the arcuate joint and configured to provide a substantially constant resistance to the rotation of the earcup mount relative to the continuous spring section.

    HEADPHONE EARCUP MOUNT IN CONTINUOUS HEADBAND-SPRING HEADPHONE SYSTEM
    3.
    发明申请
    HEADPHONE EARCUP MOUNT IN CONTINUOUS HEADBAND-SPRING HEADPHONE SYSTEM 有权

    公开(公告)号：US20210044900A1

    公开(公告)日：2021-02-11

    申请号：US17076903

    申请日：2020-10-22

    Applicant: Bose Corporation

    Inventor： Bennett P. Daley ,  Eric Douglas Curtiss ,  Allen Timothy Graff ,  Richard Arthur Grebe

    IPC: H04R5/033 ,  H04R1/10

    Abstract: Various implementations include headphone systems. In one implementation, a headband for a headphone system, includes: a continuous spring section sized to extend over a head of a user; an earcup mount coupled with an end of the continuous spring section, the continuous spring section and the earcup mount forming an arcuate joint, and the earcup mount configured to rotate relative to the continuous spring section at the arcuate joint; and a friction assembly spanning between the continuous spring section and the earcup mount, the friction assembly linearly arranged across the arcuate joint and configured to provide a substantially constant resistance to the rotation of the earcup mount relative to the continuous spring section, where the friction assembly includes a coupler having a primary axis extending across the arcuate joint, where the earcup mount rotates off-axis relative to the primary axis of the coupler.

    Systems and methods for unconstrained battery spring tab assemblies for in-ear headphone
    7.
    发明授权
    Systems and methods for unconstrained battery spring tab assemblies for in-ear headphone 有权

    公开(公告)号：US10805707B2

    公开(公告)日：2020-10-13

    申请号：US16239934

    申请日：2019-01-04

    Applicant: BOSE CORPORATION

    Inventor： Richard Arthur Grebe ,  Daniel D. Gonsalves ,  Daniel H. Sargent

    IPC: H04R25/00 ,  H04R1/10 ,  H01M2/10 ,  H01M2/02 ,  H04R1/02

    Abstract: Systems and methods are directed to a headphone having a headphone cap and a headphone housing. The headphone cap is mechanically coupled to a printed circuit board (PCB) which has a first electrical connector and a second electrical connector. The headphone housing is configured to be mechanically coupled with the headphone cap, and comprises a battery having a third electrical connector and a fourth electrical connector. The third electrical connector is configured to form a first electrical connection with the first electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. The fourth electrical connector is configured to form a second electrical connection with the second electrical connector as a result of the headphone housing being mechanically coupled with the headphone cap. In mechanically coupling the headphone housing to the headphone cap, the battery is configured to be horizontally adjacent to the PCB.

    Headphone earcup mount in continuous headband-spring headphone system
    10.
    发明授权
    Headphone earcup mount in continuous headband-spring headphone system 有权

    公开(公告)号：US11272287B2

    公开(公告)日：2022-03-08

    申请号：US17076903

    申请日：2020-10-22

    Applicant: Bose Corporation

    Inventor： Bennett P. Daley ,  Eric Douglas Curtiss ,  Allen Timothy Graff ,  Richard Arthur Grebe

    IPC: H04R5/033 ,  H04R1/10

    Abstract: Various implementations include headphone systems. In one implementation, a headband for a headphone system, includes: a continuous spring section sized to extend over a head of a user; an earcup mount coupled with an end of the continuous spring section, the continuous spring section and the earcup mount forming an arcuate joint, and the earcup mount configured to rotate relative to the continuous spring section at the arcuate joint; and a friction assembly spanning between the continuous spring section and the earcup mount, the friction assembly linearly arranged across the arcuate joint and configured to provide a substantially constant resistance to the rotation of the earcup mount relative to the continuous spring section, where the friction assembly includes a coupler having a primary axis extending across the arcuate joint, where the earcup mount rotates off-axis relative to the primary axis of the coupler.

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