Invention Application
- Patent Title: ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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Application No.: US16201239Application Date: 2018-11-27
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Publication No.: US20200093006A1Publication Date: 2020-03-19
- Inventor: Ying-Chang Tseng , Yuan-Hung Hsu , Chang-Fu Lin
- Applicant: Siliconware Precision Industries Co., Ltd.
- Priority: TW107132269 20180913
- Main IPC: H05K3/34
- IPC: H05K3/34 ; H05K1/18 ; H01Q1/22 ; H01Q1/38

Abstract:
This present disclosure provides an electronic package and a method for manufacturing the same. An antenna board with a limiter is stacked on a circuit board. A support body for holding the antenna board and the circuit board in place is provided between the antenna board and the circuit board, such that in the process of forming the support body, the limiter stops the flow of an adhesive material of the support body, and the adhesive material of the support body is prevented from overflowing onto an antenna structure of the antenna board to make sure that the antenna of the antenna board functions properly.
Public/Granted literature
- US11102890B2 Electronic package and method for manufacturing the same Public/Granted day:2021-08-24
Information query