Invention Application
- Patent Title: Shorting Pattern between Pads of a Camera Module
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Application No.: US16136315Application Date: 2018-09-20
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Publication No.: US20200100359A1Publication Date: 2020-03-26
- Inventor: Masahito Morita , Steven Webster
- Applicant: Apple Inc.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K1/11 ; H05K3/30 ; H05K3/34 ; H04N5/225

Abstract:
An apparatus includes a substrate, a first conductive pad and a second conductive pad, both disposed on the substrate, an electrically conductive trace, and a fusible alloy layer. The electrically conductive trace is laid out between the first and second pads, and is configured to conduct electrical current between the first and second pads, and has a serpentine pattern having multiple bends. The fusible alloy layer is disposed on the first pad and over a portion of the trace including no more than a predefined number of the bends.
Public/Granted literature
- US10779403B2 Shorting pattern between pads of a camera module Public/Granted day:2020-09-15
Information query