A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.