Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US16171337Application Date: 2018-10-25
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Publication No.: US20200135675A1Publication Date: 2020-04-30
- Inventor: Wen-Long LU
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/532 ; H01L21/768
Abstract:
A semiconductor package device includes a first conductive structure, a second conductive structure and a dielectric layer. The first conductive structure has a tapered portion. The second conductive structure surrounds the tapered portion of the first conductive structure and is in direct contact with a side wall of the tapered portion of the first conductive structure. The dielectric layer surrounds the tapered portion of the first conductive structure and is in direct contact with the side wall of the tapered portion of the first conductive structure.
Public/Granted literature
- US10700029B2 Semiconductor package device and method of manufacturing the same Public/Granted day:2020-06-30
Information query
IPC分类:
