Invention Application
- Patent Title: AREA SELECTIVE CYCLIC DEPOSITION FOR VFET TOP SPACER
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Application No.: US16169388Application Date: 2018-10-24
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Publication No.: US20200135893A1Publication Date: 2020-04-30
- Inventor: ZHENXING BI , Kangguo Cheng , YONGAN Xu , Yi Song
- Applicant: International Business Machines Corporation
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L21/02 ; H01L29/78 ; H01L21/768 ; H01L29/51 ; H01L29/06 ; H01L21/762

Abstract:
Embodiments of the present invention are directed to techniques for forming a vertical field effect transistor (VFET) top spacer using an area selective cyclic deposition. In a non-limiting embodiment of the invention, a first semiconductor fin is formed over a substrate. A second semiconductor fin is formed over the substrate and adjacent to the first semiconductor fin. A dielectric isolation region is formed between the first semiconductor fin and the second semiconductor fin. A top spacer is formed between the first semiconductor fin and the second semiconductor fin by cyclically depositing dielectric layers over the dielectric isolation region. The dielectric layers are inhibited from depositing on a surface of the first semiconductor fin and on a surface of the second semiconductor fin during the cyclic deposition process.
Public/Granted literature
- US10749011B2 Area selective cyclic deposition for VFET top spacer Public/Granted day:2020-08-18
Information query
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