A method for forming composite materials and associated apparatuses is presented, including positioning at least one electronic component on a lay-up surface. The method also includes positioning a composite on the lay-up surface, where the composite comprises resin and fibers. Additionally, the method includes causing a flow of the resin between the lay-up surface and the fibers. Yet further, the method includes curing the resin to form a cured resin, where the electronic component and the fibers are located in the cured resin. The composite material includes a resin having a shape based on a surface of a lay-up system. Additionally, the composite material includes fibers contained within the resin. Further, the composite materials includes at least one electronic component. The electronic component of the composite material is located in the resin based on a flow of the resin around the electronic component on the surface of the lay-up.