Invention Application
- Patent Title: 3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESION BETWEEN COPPER AND GLASS SURFACES AND ARTICLES THEREFROM
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Application No.: US16666876Application Date: 2019-10-29
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Publication No.: US20200148593A1Publication Date: 2020-05-14
- Inventor: Hoon Kim , Prantik Mazumder , Aram Rezikyan , Rajesh Vaddi
- Applicant: Corning Incorporated
- Main IPC: C03C27/04
- IPC: C03C27/04 ; C03C17/36 ; C03C17/245
Abstract:
In some embodiments, a method comprises: depositing an adhesion layer comprising manganese oxide (MnOx) onto a surface of a glass or glass ceramic substrate; depositing a first layer of conductive metal onto the adhesion layer; and annealing the adhesion layer in a reducing atmosphere. Optionally, the method further comprises pre-annealing the adhesion layer in an oxidizing atmosphere before annealing the adhesion layer in a reducing atmosphere.
Information query
