ATOMIC LAYER DEPOSITION DERIVED PROTECTIVE COATINGS FOR CALCIUM FLUORIDE OPTICAL COMPONENTS

    公开(公告)号:US20230123796A1

    公开(公告)日:2023-04-20

    申请号:US17965122

    申请日:2022-10-13

    IPC分类号: C23C16/40 C23C16/455

    摘要: A coated optical component includes an optical component and a conformal coating. The optical component is crystalline calcium fluoride and the conformal coating is an atomic layer deposition (ALD) coating in contact with a surface of the optical component. The ALD coating includes a metal fluoride ALD coating having a metal different from calcium. The ALD coating can include other metal oxide or metalloid oxide ALD coating layers. The method for making the coated optical component includes depositing an atomic layer deposition (ALD) coating on a surface of the optical component, where the ALD coating can be a metalloid oxide, a metal oxide, a metal fluoride having a metal that is different from calcium, or combinations of these. Sulfur hexafluoride is used as a fluorine source in the ALD process.

    Carrier for back end of line processing

    公开(公告)号:US11302563B2

    公开(公告)日:2022-04-12

    申请号:US16905477

    申请日:2020-06-18

    摘要: A carrier assembly is configured to support a wafer, including during back end of line (BEOL) processing. The carrier assembly includes dual carriers. A first carrier includes a stepped structure so as to situate the wafer. A side of the wafer is bonded to the first carrier without adhesive. The first carrier is positioned atop the second carrier, so as to be mechanically supported by the second carrier. Each carrier is made by wet etching of laminated glass, without mechanical polishing.

    Hermetically sealed package
    5.
    发明授权

    公开(公告)号:US11264296B2

    公开(公告)日:2022-03-01

    申请号:US16529229

    申请日:2019-08-01

    摘要: An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere.

    LOW TEMPERATURE METHODS FOR DEPOSITING INORGANIC PARTICLES ON A METAL SUBSTRATE AND ARTICLES PRODUCED BY THE SAME

    公开(公告)号:US20210404057A1

    公开(公告)日:2021-12-30

    申请号:US17279434

    申请日:2019-09-20

    摘要: Methods for depositing inorganic particles including titanium carbonitride on a metal substrate via chemical vapor deposition (CVD). In some embodiments, the CVD process may be supplied by two or more source gasses that react to form the inorganic particles. At least one of the sources gases includes a titanium source gas. And a source of carbon and nitrogen may be (a) a single source gas including a carbon and nitrogen source gas with a heat of formation energy that is less than 65.9 kilojoules per mole and/or (b) two source gases including a carbon source gas with a gas molecule having a carbon-nitrogen single bond and a nitrogen source gas. In some embodiments, the CVD process may be supplied by a source gas including a metalorganic compound to form the inorganic particles. In some embodiments, the CVD process may be supplied by an aluminum-containing metalorganic reducing agent.

    METHODS FOR COATING A SUBSTRATE WITH MAGNESIUM FLUORIDE VIA ATOMIC LAYER DEPOSITION

    公开(公告)号:US20210032744A1

    公开(公告)日:2021-02-04

    申请号:US16940836

    申请日:2020-07-28

    摘要: Atomic layer deposition methods for coating an optical substrate with magnesium fluoride. The methods include two primary processes. The first process includes the formation of a magnesium oxide layer over a surface of a substrate. The second process includes converting the magnesium oxide layer to a magnesium fluoride layer. These two primary processes may be repeated a plurality of times to create multiple magnesium fluoride layers that make up a magnesium fluoride film. The magnesium fluoride film may serve as an antireflective coating layer for an optical substrate, such as an optical lens.

    HERMETICALLY SEALED PACKAGE
    8.
    发明申请

    公开(公告)号:US20200051883A1

    公开(公告)日:2020-02-13

    申请号:US16529229

    申请日:2019-08-01

    摘要: An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere.

    ANTI-REFLECTIVE OPTICAL COATINGS AND METHODS OF FORMING THE SAME

    公开(公告)号:US20230161077A1

    公开(公告)日:2023-05-25

    申请号:US17980139

    申请日:2022-11-03

    摘要: According to at least one feature of the present disclosure, a method of forming a film of an optical element, includes: positioning a substantially transparent lens in a reactor chamber, wherein the lens defines a curved surface; exposing the lens to a first precursor comprising one of lanthanum or gadolinium such that the first precursor is deposited on the curved surface of the lens; exposing the first precursor on the curved surface to a first oxidizer such that the first precursor present on the curved surface of the lens reacts with the first oxidizer to form a high refractive index layer of the film; exposing the high refractive index layer to a second precursor such that the second precursor is deposited on the high refractive index layer; and exposing the second precursor on the high refractive index layer to a second oxidizer such that the second precursor present on the high refractive index layer reacts with the second oxidizer to form a low refractive index layer of the film.