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公开(公告)号:US20240247368A1
公开(公告)日:2024-07-25
申请号:US18595913
申请日:2024-03-05
申请人: CORNING INCORPORATED
发明人: Ming-Huang Huang , Hoon Kim , Jue Wang
IPC分类号: C23C16/30 , C23C16/455 , G01N21/95 , G02B1/115 , H01L21/67
CPC分类号: C23C16/30 , C23C16/45553 , G02B1/115 , H01L21/67288 , G01N21/9501
摘要: Atomic layer deposition methods for coating an optical substrate with magnesium fluoride. The methods include two primary processes. The first process includes the formation of a magnesium oxide layer over a surface of a substrate. The second process includes converting the magnesium oxide layer to a magnesium fluoride layer. These two primary processes may be repeated a plurality of times to create multiple magnesium fluoride layers that make up a magnesium fluoride film. The magnesium fluoride film may serve as an antireflective coating layer for an optical substrate, such as an optical lens.
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公开(公告)号:US11939670B2
公开(公告)日:2024-03-26
申请号:US17279434
申请日:2019-09-20
申请人: CORNING INCORPORATED
发明人: Hoon Kim , Charles Andrew Paulson
IPC分类号: C23C16/36 , C23C16/46 , C23C16/52 , B28B3/26 , C22C38/02 , C22C38/04 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/52
CPC分类号: C23C16/36 , C23C16/46 , C23C16/52 , B28B3/269 , C22C38/02 , C22C38/04 , C22C38/42 , C22C38/44 , C22C38/46 , C22C38/52
摘要: Methods for depositing inorganic particles including titanium carbonitride on a metal substrate via chemical vapor deposition (CVD). In some embodiments, the CVD process may be supplied by two or more source gasses that react to form the inorganic particles. At least one of the sources gases includes a titanium source gas. And a source of carbon and nitrogen may be (a) a single source gas including a carbon and nitrogen source gas with a heat of formation energy that is less than 65.9 kilojoules per mole and/or (b) two source gases including a carbon source gas with a gas molecule having a carbon-nitrogen single bond and a nitrogen source gas. In some embodiments, the CVD process may be supplied by a source gas including a metalorganic compound to form the inorganic particles. In some embodiments, the CVD process may be supplied by an aluminum-containing metalorganic reducing agent.
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3.
公开(公告)号:US20230123796A1
公开(公告)日:2023-04-20
申请号:US17965122
申请日:2022-10-13
申请人: CORNING INCORPORATED
发明人: Donald Erwin Allen , Gerald Philip Cox , Keith John Donohue , Ming-Huang Huang , Hoon Kim , Jue Wang
IPC分类号: C23C16/40 , C23C16/455
摘要: A coated optical component includes an optical component and a conformal coating. The optical component is crystalline calcium fluoride and the conformal coating is an atomic layer deposition (ALD) coating in contact with a surface of the optical component. The ALD coating includes a metal fluoride ALD coating having a metal different from calcium. The ALD coating can include other metal oxide or metalloid oxide ALD coating layers. The method for making the coated optical component includes depositing an atomic layer deposition (ALD) coating on a surface of the optical component, where the ALD coating can be a metalloid oxide, a metal oxide, a metal fluoride having a metal that is different from calcium, or combinations of these. Sulfur hexafluoride is used as a fluorine source in the ALD process.
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公开(公告)号:US11302563B2
公开(公告)日:2022-04-12
申请号:US16905477
申请日:2020-06-18
申请人: Corning Incorporated
发明人: Hoon Kim , Jin Su Kim , Varun Singh
IPC分类号: H01L21/683 , C03C15/00 , H01L21/78 , H01L21/304
摘要: A carrier assembly is configured to support a wafer, including during back end of line (BEOL) processing. The carrier assembly includes dual carriers. A first carrier includes a stepped structure so as to situate the wafer. A side of the wafer is bonded to the first carrier without adhesive. The first carrier is positioned atop the second carrier, so as to be mechanically supported by the second carrier. Each carrier is made by wet etching of laminated glass, without mechanical polishing.
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公开(公告)号:US11264296B2
公开(公告)日:2022-03-01
申请号:US16529229
申请日:2019-08-01
申请人: Corning Incorporated
发明人: Ming-Huang Huang , Hoon Kim , Xu Ouyang
IPC分类号: H01L23/31 , H01L21/56 , B81B7/00 , H01L21/02 , H01L21/768 , H01L23/498
摘要: An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere.
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公开(公告)号:US20210404057A1
公开(公告)日:2021-12-30
申请号:US17279434
申请日:2019-09-20
申请人: CORNING INCORPORATED
发明人: Hoon Kim , Charles Andrew Paulson
IPC分类号: C23C16/36 , C22C38/52 , C22C38/46 , C22C38/44 , C22C38/42 , C22C38/02 , C22C38/04 , B28B3/26
摘要: Methods for depositing inorganic particles including titanium carbonitride on a metal substrate via chemical vapor deposition (CVD). In some embodiments, the CVD process may be supplied by two or more source gasses that react to form the inorganic particles. At least one of the sources gases includes a titanium source gas. And a source of carbon and nitrogen may be (a) a single source gas including a carbon and nitrogen source gas with a heat of formation energy that is less than 65.9 kilojoules per mole and/or (b) two source gases including a carbon source gas with a gas molecule having a carbon-nitrogen single bond and a nitrogen source gas. In some embodiments, the CVD process may be supplied by a source gas including a metalorganic compound to form the inorganic particles. In some embodiments, the CVD process may be supplied by an aluminum-containing metalorganic reducing agent.
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公开(公告)号:US20210032744A1
公开(公告)日:2021-02-04
申请号:US16940836
申请日:2020-07-28
申请人: CORNING INCORPORATED
发明人: Ming-Huang Huang , Hoon Kim , Jue Wang
IPC分类号: C23C16/30 , H01L21/67 , G02B1/115 , C23C16/455
摘要: Atomic layer deposition methods for coating an optical substrate with magnesium fluoride. The methods include two primary processes. The first process includes the formation of a magnesium oxide layer over a surface of a substrate. The second process includes converting the magnesium oxide layer to a magnesium fluoride layer. These two primary processes may be repeated a plurality of times to create multiple magnesium fluoride layers that make up a magnesium fluoride film. The magnesium fluoride film may serve as an antireflective coating layer for an optical substrate, such as an optical lens.
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公开(公告)号:US20200051883A1
公开(公告)日:2020-02-13
申请号:US16529229
申请日:2019-08-01
申请人: Corning Incorporated
发明人: Ming-Huang Huang , Hoon Kim , Xu Ouyang
IPC分类号: H01L23/31 , H01L21/56 , H01L21/768 , H01L21/02 , H01L23/498 , B81B7/00
摘要: An electrical component package includes a glass substrate, an interposer panel positioned on the glass substrate, the interposer panel comprising a device cavity, a wafer positioned on the interposer panel such that the device cavity is enclosed by the glass substrate, the interposer panel, and the wafer. The electrical component package further includes a metal seed layer disposed between the interposer panel and the wafer, and a dielectric coating. The dielectric coating hermetically seals the interposer panel to the glass substrate, the interposer panel to the metal seed layer and the wafer, and the interposer panel hermetically seals the metal seed layer to the glass substrate such that the device cavity is hermetically sealed from ambient atmosphere.
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9.
公开(公告)号:US20230411484A1
公开(公告)日:2023-12-21
申请号:US18035159
申请日:2021-11-10
申请人: CORNING INCORPORATED
发明人: Hoon Kim , Robert George Manley
IPC分类号: H01L29/45 , H01L29/786 , H01L29/417 , H01L29/40 , H01L21/02 , C23C16/50 , C23C16/40 , C23C16/448
CPC分类号: H01L29/458 , H01L29/786 , H01L29/41733 , H01L29/401 , C23C16/4482 , H01L21/02205 , H01L21/02274 , C23C16/50 , C23C16/40 , H01L21/02175
摘要: The present disclosure includes a semiconductor device comprising a substrate including a device surface and a patterned metallic electrode disposed on the substrate. The patterned metallic electrode is formed of one or more of copper, gold, and silver. The patterned metallic electrode comprises a lower surface proximate to the substrate, an upper surface, and a sidewall extending between the lower surface and the upper surface a sidewall barrier layer extending over the sidewall. The sidewall barrier layer may be a manganese oxide barrier layer.
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公开(公告)号:US20230161077A1
公开(公告)日:2023-05-25
申请号:US17980139
申请日:2022-11-03
申请人: CORNING INCORPORATED
发明人: Ming-Huang Huang , Hoon Kim , Jue Wang
IPC分类号: G02B1/115 , C23C16/455 , C23C16/40
CPC分类号: G02B1/115 , C23C16/45527 , C23C16/45553 , C23C16/405 , C23C16/402 , C23C16/403
摘要: According to at least one feature of the present disclosure, a method of forming a film of an optical element, includes: positioning a substantially transparent lens in a reactor chamber, wherein the lens defines a curved surface; exposing the lens to a first precursor comprising one of lanthanum or gadolinium such that the first precursor is deposited on the curved surface of the lens; exposing the first precursor on the curved surface to a first oxidizer such that the first precursor present on the curved surface of the lens reacts with the first oxidizer to form a high refractive index layer of the film; exposing the high refractive index layer to a second precursor such that the second precursor is deposited on the high refractive index layer; and exposing the second precursor on the high refractive index layer to a second oxidizer such that the second precursor present on the high refractive index layer reacts with the second oxidizer to form a low refractive index layer of the film.
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