Invention Application
- Patent Title: High-density non split cable
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Application No.: US16739276Application Date: 2020-01-10
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Publication No.: US20200153183A1Publication Date: 2020-05-14
- Inventor: David N. Warren
- Applicant: HD Networks, LLC
- Main IPC: H01R25/00
- IPC: H01R25/00 ; H01R13/717 ; H01R13/6463 ; H01R27/02 ; H01R24/64

Abstract:
Disclosed is a high-density non split cable for use in a network incorporating high-density connections for increased efficiency, network operation and management. The high-density connections are incorporated into the patch panel, network switch, and cables that connects them, as well as into cable analyzers and printed circuit boards (PCBs) which allow for a complete network within a single computer running virtualization software.
Public/Granted literature
- US11070015B2 High-density non split cable Public/Granted day:2021-07-20
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